COREMA-2000 Contactless Resistivity Mapping

• Resistivity mapping and uniformity assessment of compound semiconductor wafers before chip fabrication

• Quality control of incoming wafers in semiconductor production lines

• Real-time process monitoring of high-resistivity substrates in RF, optoelectronics, photonics, military, aerospace, and power device manufacturing

• Applicable to materials such as GaAs, SiC, GaN, GaO, CdTe, InP, and other semi-insulating substrates

• Original developer of the SEMI standard and leading global support network
• Fully compliant with SEMI M87-0422 industry standard for non-contact resistivity measurement
• Trusted and deployed globally in 14+ countries
• No calibration needed for routine operation
• User-friendly graphical interface with colored topographic display
• Non-contact, non-destructive full-wafer resistivity measurement
• Excellent measurement repeatability and wide measurement range
• Measurement Principle: Contactless capacitance technique for full-water resistivity characterization across a very wide range in the semi-insulating region
• Operator & Automation:
  
  • Full automation supported on request (especially Corema-2201 model with robotic wafer handling)
  • Measurement parameters and process sequences fully customizable
  • Semi-automatic wafer placement
• Data & Software:
  
  • Built-in software provides detailed wafer maps and resistivity profiles
  • Customizable reporting tailored to industry standards with data available in various formats; Semilab internal format, TXT, and PDF

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• Excellent repeatibility,  <1%* (*:get in touch for further details),
• Sample Surface: Etched or polished, as-cut or bare wafer,
• Sample size up to 200 mm diameter,
• Minimum sample size: 10 x 10 mm shard for single point measurement,
• Wide measurement range: 10⁵to 10¹² Ω·cm
• Measurement parameters:
  
  • Full wafer topogram with up to 1024x1024 data points
  • Fast evaluation
  • Wafer diameter: up to 200 mm
  • Manual wafer handling
  • Automatic non-contact adjustment
  • Mapping capability

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