The modular Spectroscopic Ellipsometer is a highly versatile thin film characterization system covering the widest spectral range in a single tool (190 nm – 25 µm). It enables non-contact, non-destructive analysis of film thickness, optical constants, multilayer stacks, and advanced material properties with unmatched flexibility.
• Highly versatile modular spectroscopic ellipsometer with over 70 configurations
• Covers the widest spectral range in a single system: 190 nm (Deep UV) to 25 µm (Mid-IR)
• Supports advanced thin film analysis, optical property characterization, and complex multilayer stacks
• Partial or full automation: manual / automated sample loading with optional automated wafer mapping
• Recipe-driven with modern graphical user interface
• Measurement speed: from 167 ms to several seconds per point (typically 1–10 s)
• Non-contact, non-destructive measurements
• Modular and upgradeable, supporting many hardware/software options including IR, NIR, cryostats, mapping systems, etc.
• Wavelength range:
• Angle of incidence range (UV-VIS-NIR): 12.5° - 90°
• Angle of incidence range (With camera): 25° - 90°
• Pixels in UV-VIS: 1024
• Pixels in NIR: 256/512
• Typical measurement time: 1-10 sec (DUV to NIR)
• Standard Reference Material: (~1200 Å SiO2 on Si)
