2003
International Conference on Characterization and Metrology for ULSI Technology, 2003

In‐line, Non‐destructive Electrical Metrology of Nitrided Silicon Dioxide and High‐k Gate Dielectric Layers

Header image

Abstract

Highly sensitive, accurate and precise methods for measuring the properties of dielectrics used in sub 0.13 μm technology are required. It is particularly critical to monitor the electrical properties of the gate dielectric. The electrical properties of thin dielectrics are assessed with a new, non‐contaminating, non‐damaging elastic probe. This probe forms a small diameter (∼30 μm to 50 μm ) Elastic Metal gate (EM‐gate) on the surface of a dielectric. Subsequent electrical measurements are made with advanced Capacitance‐Voltage (CV), Conductance‐Voltage (GV), and Current‐Voltage (IV) techniques. Valuable and essential information about the dielectric thickness and quality, leakage current, Si‐SiO2 interface quality, and channel carrier density profile is obtained.

Topic

Dielectrics, Dielectric thin films, Electrical properties, Elasticity, Dielectric properties

Author

R.J. Hillard, P.Y. Hung, W. Chism, C.W. Ye, W.H. Howland, L.C. Tan, C.E. Kalnas

Related Products

See our related products to this publication:
No items found.

Contact us for Information and Pricing

Get expert advice and tailored solutions for your research needs