2019
19th International Workshop on Junction Technology (IWJT) proceedings

Review of applications of Defect Photoluminescence Imaging (DPLI) during IC processing

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Abstract

As Si is an indirect band gap material, the PL generated by phonon assisted band-to-band (B2B) radiative recombination (of energy equal to energy gap of Si) is very weak; about 10 orders of magnitude lower than the exciting photon flux [1]. If crystallographic defects are present then at room temperature an additional broad defect PL peak is generated (DPL) with energy smaller than the band gap of Si [1], [2], [3] . At room temperature, defect-band PL intensity is orders of magnitude lower than the B2B intensity [1].

Topic

crystal defects, defect inspection, Ion Implantation, Photoluminescence Imaging, process monitoring, Deep Trenches

Author

L. Jastrzebski, R. Duru, D. Le-Cunff, M. Cannac S. Joblot, I. Mica, M.L.Polignano, A.Galbiati, P. Monge Roffarello,G. Nadudvari, Z. Kiss, I. Lajtos, A. Pongracz, G. Molnár, M. Nagy, L. Dudás, P. Basa, B.Greenwood, J.Gambino

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